JPH02146823U - - Google Patents
Info
- Publication number
- JPH02146823U JPH02146823U JP5379189U JP5379189U JPH02146823U JP H02146823 U JPH02146823 U JP H02146823U JP 5379189 U JP5379189 U JP 5379189U JP 5379189 U JP5379189 U JP 5379189U JP H02146823 U JPH02146823 U JP H02146823U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- electrode layers
- electronic component
- type electronic
- portions
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007598 dipping method Methods 0.000 claims 1
- 239000012530 fluid Substances 0.000 claims 1
- 239000003973 paint Substances 0.000 claims 1
- 238000000926 separation method Methods 0.000 claims 1
- 238000005452 bending Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/01—Mounting; Supporting
- H01C1/014—Mounting; Supporting the resistor being suspended between and being supported by two supporting sections
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Ceramic Capacitors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5379189U JPH02146823U (en]) | 1989-05-10 | 1989-05-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5379189U JPH02146823U (en]) | 1989-05-10 | 1989-05-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02146823U true JPH02146823U (en]) | 1990-12-13 |
Family
ID=31575284
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5379189U Pending JPH02146823U (en]) | 1989-05-10 | 1989-05-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02146823U (en]) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010087250A1 (ja) * | 2009-01-29 | 2010-08-05 | 株式会社村田製作所 | セラミック電子部品 |
| JP2017037943A (ja) * | 2015-08-07 | 2017-02-16 | Koa株式会社 | 面実装チップバリスタ |
-
1989
- 1989-05-10 JP JP5379189U patent/JPH02146823U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010087250A1 (ja) * | 2009-01-29 | 2010-08-05 | 株式会社村田製作所 | セラミック電子部品 |
| JP2017037943A (ja) * | 2015-08-07 | 2017-02-16 | Koa株式会社 | 面実装チップバリスタ |
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